Community and Collaboration 

The 2024 preliminary program and conference at-a-glance are now available below. Please note that program and content are still under development.


2024 preliminary program   2024 conference at-a-glance 


Trusted Supplier Industry Day
Monday, March 18
8 am – 5 pm

The thirteenth Trusted Supplier Industry Day will be an interactive event with an opportunity for all attendees to hear from key leaders and provide input on the critical issues facing our community. We have seen tremendous change since last year’s Industry Day. The CHIPS Program office has begun funding projects under the CHIPS and Science Act for the construction, expansion, or modernization of commercial facilities for the fabrication of leading-edge, current-generation, and mature-node semiconductors. DoD announced in August the eight Microelectronics Commons hubs that will form a national network to create direct pathways to commercialization for US microelectronics researchers and designers from “lab to fab”, and in December announced the project areas in which hubs can propose projects to be funded. The Industry Day program will feature speakers who will address these areas and topics including evolving microelectronics strategies with a focus on security and integrity. Speakers will also address developments regarding the CHIPS Research and Development Office’s National Semiconductor Technology Center as well as the National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (APPF) where successful advanced packaging innovation development efforts will be evaluated and validated for scaled transition to U.S. manufacturing. The Industry Day is being designed to provoke thoughtful conversations and up-to-date information on the many activities being pursued to restore U.S. leadership in semiconductor manufacturing with a semiconductor supply chain that considers security along with technical performance. Please join us on March 18th to add your voice to the discussion of the most critical electronics issues of the day.


Microelectronics Assurance Workshop

Monday, March 18
8:30 am – 5 pm

Microelectronics Assurance is one of the key technical execution areas (TEA) under the OUSD(R&E) Trusted & Assured Microelectronics (T&AM) program.  The Microelectronics Assurance TEA (MAT) meets the needs of key stakeholders to ensure the confidentiality and integrity of microelectronic components used in DoD systems by providing hardware assurance and vulnerability assessments; FPGA supply chain lifecycle assurance; microelectronics supply chain risk and threat assessments; and the development of best practices guidance, assessment tools, technologies, techniques, and mitigations. MAT leverages the expertise and services provided by the Joint Federated Assurance Center (JFAC) Hardware Assurance Labs to meet the goals and objectives of MAT.


On-shore Advanced Packaging Capabilities
Monday, March 18
1:00 – 4:30 pm

The government Reshore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) and Defense Production Act Investment (DPAI) teams will present overviews of currently funded on-shore advanced packaging capabilities. Program overviews, interactive discussions, and presentations from vendors on their advanced packaging manufacturing capabilities will provide an opportunity for attendees to hear from key stakeholders and provide input on the critical issues facing the advanced packaging community. Awards have been made through the Industrial Base Analysis and Sustainment (IBAS) program, RESHAPE effort, to Osceola County Fl/Skywater/BRIDG and Micross Components. The DPAI program has awarded Calument and GreenSource Fabrication LLC. Speakers will address key needs and developments in packaging to include Fan-Out Wafer Level Packaging (FOWLP), Wafer Prep and High-Density Interconnent/High Density Build-up (HDI/HDBU). Please join us on the afternoon of March 18th to hear the latest in government packaging capability investments and be part of the needs and challenges discussions for this advanced packaging community.

Panel Discussions

DoD Workforce Development Accomplishments and Future Directions
Wednesday, March 20
10:30 am - 12:10 pm

There is a big push on workforce development (WFD) in the CHIPS Act to address the gaps identified by the various trade organizations. USG and DoD programs are unable to meet staffing goals for domestic, clearable microelectronics engineers. The Scalable Asymmetric Lifecycle Engagement (SCALE) program continues to assess and aggregate the stakeholders’ needs and provide data-driven microelectronics workforce recommendations. The DoD focus areas cover radiation-hardening, heterogeneous integration/advanced packaging, system on a chip, embedded system security/trusted AI, supply chain awareness, and others. The panel will discuss who is responsible for WFD, possible standards, and how the progress is measured. It will look at different groups as post-secondary, kindergarten-12, and others. There is need to grow the research work force to use the key microelectronic investments.


STEM the “Leaky Pipeline”
Wednesday, March 20
1:30 - 3:10 pm

Studies show that women and underserved populations leave the STEM workforce at significantly higher rates, which is of particular concern as USG and DoD programs are unable to meet staffing goals for domestic, clearable microelectronics engineers. Human resources initiatives alone have not been able to STEM the “leaky pipeline”. It is time to take the problems to the engineers. Peers, technical leads, and managers have a greater impact on the daily experience of the individual engineer than yearly company mandated trainings. The engineering community must own this problem and find the solution. This panel features conversation between members from government, academia, and industry to explore hidden barriers to employee growth and retention while seeking actionable quantifiable solutions. Panelists will share experiences with programs aimed at career development for underserved populations. The panel will identify strategies for enhancing systems for items such as program technical effort, performance evaluations and work allocation, as well as quantitative methods used to evaluate initiatives aimed at improving workforce equity.


Leveraging Startup Innovation within the DoD Microelectronics Community
Wednesday, March 20
3:30 - 5:10 pm

Small companies that are new to working with the USG often do not have the resources to effectively share their perspectives with government decision-makers and struggle to identify relevant funding opportunities within active research and development (R&D) initiatives. Such companies play a critical role in driving rapid innovation and fueling economic growth. As the microelectronics ecosystem has become more complex, closer collaborations between all stakeholders are critical to maintaining access to the best technology in the industry. The panel will focus on domestic startups and emerging small- and mid-size microelectronics companies with discussion surrounding how such companies can more actively participate within major government-funded R&D initiatives, such as the CHIPS Act. The panel will provide perspectives from small commercial companies and USG government stakeholders, and discuss challenges they face, how they can impact the community, and how to better leverage such companies for USG microelectronics needs and to bolster domestic capabilities.


The T&AM MPW Program Panel Discussion
Thursday, March 21
10:30 am - 12:10 pm

The Trusted and Assured Microelectronics (T&AM) Program within OUSD Research and Engineering (R&E) aims to provide the U.S. warfighter with the state-of-the-art (SOTA), assured microelectronics required to meet DoD system modernization goals. One of the primary objectives of the program is to enable access to commercial industry and government to develop and demonstrate SOTA designs that advance DoD initiatives. T&AM sponsors multi-project wafer (MPW) run opportunities to enable access to SOTA US commercial foundries ≤ 22nm in support of the DoD microelectronics goals and to aid in developing specific foundation and functional intellectual properties. Currently, T&AM sponsors MPW opportunities with GlobalFoundries and Intel Foundry Services. The program is available to relevant designs from the defense industrial base (DIB), government laboratories, and academia. The panel will provide an overview of T&AM MPW opportunities and a discussion of technologies currently sponsored.