GOMACTech-18 AGENDA
50 Years of GOMACTech, 50 Years of
Advanced Technology
Click here for the online program.
Click here for information on the GOMACTech Tutorial on Neuromorphic Computing!
The GOMACTech Tutorial will be
on Monday, March 12, 2018 and will begin at 8:00AM
Trusted Suppliers Industry Session
Monday, 12 March 2018, 8:30am - 5:00pm
Hyatt Regency Miami, Miami,
Florida Grand Ballroom
Organizer:
Harry Kellzi, Teledyne
The 9th Trusted Supplier Industry Day at GOMACTech 2018
is shaping up to be an interesting event! This year we are highlighting “Hardware Assurance for Mission Success” as
our guiding topic and main agenda.
Our keynote speaker, Mr. Karl Heimer, is a leading expert on automotive cybersecurity and will draw parallels between the hardware challenges faced with increasingly connected cars and defense systems’ security concerns.
We will learn about the microelectronics activities under the Office of the Secretary of Defense organizations: DARPA, DASD(SE) and DMEA.
Two Navy initiatives will be featured: CYBERSAFE and the Trusted Printed Circuit Board and Interconnect Technologies Executive Agent.
Are you wondering about the defense microelectronics market and supplier base? We’ll hear about recent assessments conducted by the Institute for Defense Analyses and the Department of Commerce, respectively.
To close the day, we will have a Government Systems Panel with participants from the Army, Navy, Air Force, Missile Defense Agency, and National Nuclear Safety Administration.
This information-packed industry day is organized by the Trusted Suppliers Steering Group and Harry Kellzi from Teledyne will be moderating the event.
Please join us for our ninth Industry Day and stay up-to-date on Trusted Microelectronics initiatives!
Networking Reception
Sunday, 11 March 2018, 6:00PM-8:00PM
We are pleased to hold our pre Industry Day a special get together event with the Trusted Suppliers Industry
Networking Reception on Sunday evening. Please come
and join us for some food and drinks (2 drink tickets
included), meet your industry peers and friends, just have some good time prior to Monday’s full agenda conference.
All GOMACtech 2018 registrants are invited to this
Sunday evening reception event.
The GOMACTech-18 Committee is pleased to announce our distinguished Keynote and Kilby Speakers:
Keynote Address
(Tuesday, 13 March, 8:45AM – 9:30AM)
Microelectronics Innovation and Security
Kristen Baldwin, Acting Deputy Assistant Secretary of
Defense for Systems Engineering
The Department of Defense (DoD) must have access to trusted, assured microelectronics to maintain current defense capabilities, and to continue developing future overmatch capability for our defense systems. Therefore, the Department takes a vital interest in ensuring the economic health and competitiveness of domestic commercial microelectronics markets, upon which DoD relies to deliver the majority of its parts.
Our foreign competitors have engaged in significant investments, actions, and market manipulations that threaten U.S. competitiveness and national security. In response, as directed by Congress, and in coordination with stakeholders across government and industry, DoD developed a strategy to ensure access to assured microelectronics.
The office of the Deputy Assistant Secretary of Defense for Systems Engineering (DASD(SE)) leads the strategy effort which builds upon the existing Trusted Access Program Office (TAPO) and Trusted Supplier frameworks, the Trusted and Assured Microelectronics (T&AM) Program, and the Department’s broad research and development (R&D) base.
(Tuesday, 13 March, 10:00AM – 10:45AM)
GOMACTech: A 50-year historical perspective and a look into our future
Honorable Zachary J.Lemnios, Vice President, IBM Research
The Government Microelectronics Conference was founded in 1968 as a technial forum to provide the US Government with the latest results in the field, announce major government microelectronics initiatives, and catalyze new technial areas for national security impact. With five decades of strong attendance, this has been the venue to announce such key programs as VHSIC, MIMIC, high performance computing, radiation hardened electronics and more recently a broad range of RF, MEMS and photonics initiatives.
At its founding, the US Government was driving the research agenda and leading the private sector in the development and application of many of these technologies. More recently much of the research agenda and the innovation pipeline has shifted to the commercial sector. We see this today in the rapid development and application of high performance compute at the edge, secure cloud and the rapidly advancing work of machine learning and artificial intelligence.
This talk will provide a historical perspective of the impact that GOMACTech has had, outline a set of technical areas that are rapidly accelerating in the commercial sector and take a look into our future.
(Tuesday, 13 March, 10:45AM – 11:45AM)
The coming era of specialization - and its meaning
for the DOD
William Chappell, Ph.D., Director, Microsystems Technology Office
Defense Advanced Research Projects Agency
The electronics field is at the start of a new revolution, of which we can start to see the first inklings. This revolution is a move from the era of scaling and generalization to the era of uniqueness and specialization. The continuity of Moore’s law allowed for the abstraction of specialized needs and incentivized general hardware designs that relied on specialization in the software stack. This was preferable even for high performance systems, if it allowed the product to track more closely to the improvements that came from Moore’s law. This preference was further exacerbated within the DOD, where fielding times can be quite long. The need for obtaining a generalized solution quickly outweighed the benefits of waiting for even the most modern ASIC. Therefore, the DOD has not used electronics as a differentiator over the past few decades, except in rare niche areas. System integration has been the key differentiator instead.
However, we recently have seen a trend of moving away from general computing hardware (CPU) and to specialization, as demonstrated by the broad acceptance of FPGAs across the military and more recently by the embrace of GPUs for machine learning applications. In the commercial domain, even more specialization is indicated with the introduction of Google’s TPU and the purchase of neuromorphic chip startup Nervana by Intel. So, the DOD faces a foundational conundrum. The benefits of specializing for an application are clear, particularly with a mandate to have better performance than the rest of the world, but design costs and complexity have made ASICs more difficult to make. DOD is struggling with access, human resourcing, and sources of manufacturing.
How the US military will respond to this new world is not clear. However, lowering the barrier to specialization is step one. DARPA has started an effort, the Electronics Resurgence Initiative, to prepare the DOD and the country for this coming era of specialization to maintain global leadership as we navigate this inflection in Moore’s Law.
SiC Power Devices: A 35 year journey from Conception to Commercialization
B. Jayant Baliga, Distinguished University Professor, North Carolina State University
This paper will review the development of silicon carbide based power devices starting from the theoretical conception in 1979 to recent commercial availability of the devices. The Baliga’s Figure-of-Merit (BFOM) derived in 1979 predicted a reduction in the specific on-resistance of the drift region in SiC power Schottky rectifiers and power MOSFET by over 200-times. The first practical devices made in the 1990s under the sponsorship of the Power Semiconductor Research Center (PSRC) at NCSU validated these predictions. The world-wide recognition of the potential of this technology for main-stream commercial and industrial (as well as military) applications led to growth in funding culminating in commercial products appearing in the market during the last 5 years. In addition to tracing this history, the paper will discuss recent results achieved at PowerAmerica to establish a manufacturing process called PRESiCETM (PRocess Engineered for manufacturing SiC Electronic-devices) at a foundry in Texas.
